|
|
May 23, 2007
IBM, CHARTERED, SAMSUNG, INFINEON and FREESCALE Expand Technology
Agreements
East Fishkill, N.Y.; Singapore; Munich, Germany; Seoul, South Korea;
and Austin, Texas, May 23, 2007 : In a
move that signals a firm and ongoing commitment to
future technology leadership, IBM and its Common PlatformTM technology
partners Chartered Semiconductor Manufacturing and Samsung Electronics, along with
joint-development alliance partners Infineon Technologies AG and Freescale Semiconductor,
have signed a series of semiconductor process development and
manufacturing agreements.
The joint development agreements between these companies will
now include 32-nanometer (nm) bulk complementary metal oxide semiconductor
(CMOS) process technologies and joint development of process design
kits (PDKs) to support that technology. Building on the
success of earlier joint development and manufacturing agreements at
90nm, 65nm and 45nm, alliance partners will be able
to produce high-performance, energy-efficient chips at 32nm.
The partners plan
to pool their combined expertise and collaborate to design,
develop and manufacture advanced technology through 2010. Those technologies,
which are the leading platform for a broad range
of systems -- ranging from next-generation hand-held products to
the world's highest performance supercomputers -- may be used
by the five partners and other companies to help
solve real-life problems in fields such as medicine, communications,
transportation and security.
'Collaborative innovation key to leadership'
"IBM remains
convinced that collaborative innovation in an open ecosystem of
partners is the key to technology leadership, both now
and in the years to come," said Michael Cadigan,
general manager, semiconductor solutions, IBM Global Engineering Solutions. "Today's
announcement validates that strategy by meeting client requirements for
leadership technology. With the extensions of our agreements to
the 32nm generation -- including manufacturing and IBM Research
to complement the proven joint development model in place
for well over a decade -- IBM is working
together with its alliance partners to deliver leading-edge technology
that promises to dramatically change the way we live,
work and play."
”Infineon continues its successful strategy to develop
the most advanced technologies with its alliances and to
manufacture them with partners,” said Dr. Franz Neppl, senior
vice president, Base Technologies & Services, Infineon Technologies AG.
“The jointly developed technologies, together with Infineon’s application and
product design know-how, will enable Infineon to provide to
our customers cost-effective system-on-silicon solutions and manufacturing capabilities for
our core business in communications and automotive/industrial areas."
“Major new
challenges are expected at the 32nm node, both in
materials as well as device structures,” said Dr. Oh-Hyun
Kwon, president, System LSI Division, Semiconductor Business, Samsung Electronics
Co., Ltd. “We expect to deliver breakthrough technology by
working together with our partners, who bring a variety
of expertise as leaders in the industry.”
IBM, Chartered and
Samsung, as Common Platform technology manufacturers, will be able
to use the jointly developed 32nm process technology and
design kits to synchronize their manufacturing facilities. This helps
facilitate the flexibility to produce nearly identical chips for
their respective high-volume OEM clients, who require a multi-sourcing
model and expect early access to process technology.
The five
companies will work together to deliver industry-leading technology for
high-performance and low-standby power products through :
a focus
on low cost and minimum complexity while retaining performance
leadership
implementation of new materials such as high-k/metal gate,
advanced stress engineering, and extreme low-k films in the
back-end-of-line (BEOL)
state- of- the-art immersion lithography to achieve
competitive density and chip size
a focus on quality
analog models for the digital communications marketplace
providing a
platform for derivative technologies such as RF CMOS and
embedded DRAM, or eDRAM
In addition, by using common
manufacturing electrical specifications across manufacturing platform partners, technologies can
more easily be transferred between partner facilities.
“The industry has
recognized the value and importance of the collaborative model
in driving robust, cost-effective solutions,” said Chia Song Hwee,
president and CEO of Chartered. “As we now collaborate
on our fourth node under this joint model, we
have seen how each company brings unique strengths and
expertise to drive a customer-centric offering. The results of
our collaboration have served as a platform for providing
customers with world-class, flexible sourcing solutions.”
The 32nm cooperation
will include the joint development of an enablement package,
similar to previous alliance developments. This package will support
the most common design tools that will allow customers
to utilize the full potential of this advanced technology
for their specific products.
As with previous nodes, 32nm development
activities will be conducted at IBM's state-of-the-art 300 millimeter
(mm) semiconductor fabrication facility in East Fishkill, N.Y. Freescale
originally announced its membership in the alliance on Jan.
23.
About IBM
For more information about semiconductors, please visit: www.ibm.com/chips.
About Chartered
Chartered Semiconductor Manufacturing (Nasdaq:CHRT - News:SGX-ST:Chartered), one of
the world's top dedicated semiconductor foundries, offers leading-edge technologies
down to 65 nanometer (nm), enabling today's system-on-chip designs.
The company further serves its customers' needs through a
collaborative, joint development approach on a technology roadmap that
extends to 32nm. Chartered's strategy is based on open
and comprehensive design enablement solutions, manufacturing enhancement strategies, and
a commitment to flexible sourcing. In Singapore, the company
operates a 300mm fabrication facility and four 200mm facilities.
Information about Chartered can be found at www.charteredsemi.com.
About Samsung
Electronics
Samsung Electronics Co., Ltd. is a global leader in
semiconductor, telecommunication, digital media and digital convergence technologies with
2006 parent company sales of US$63.4 billion and net
income of US$8.5 billion. Employing approximately 138,000 people in
124 offices in 56 countries, the company consists of
five main business units: Digital Media Business, LCD Business,
Semiconductor Business, Telecommunication Network Business, and Digital Appliance Business.
Recognized as one of the fastest growing global brands,
Samsung Electronics is a leading producer of digital TVs,
memory chips, mobile phones and TFT-LCDs. For more information,
please visit www.samsung.com.
About Infineon
Infineon Technologies AG, Munich, Germany, offers
semiconductor and system solutions addressing three central challenges to
modern society - energy efficiency, mobility and security. In
fiscal year 2006 (ending September), the company achieved sales
of Euro 7.9 billion (including Qimonda sales of Euro
3.8 billion) with approximately 42,000 employees worldwide (including approximately
12,000 Qimonda employees). With a global presence, Infineon operates
through its subsidiaries in the US from San Jose,
CA, in the Asia-Pacific region from Singapore, and in
Japan from Tokyo. Infineon is listed on the Frankfurt
Stock Exchange and on the New York Stock Exchange
(ticker symbol: IFX).
About Freescale Semiconductor
Freescale Semiconductor is a global
leader in the design and manufacture of embedded semiconductors
for the automotive, consumer, industrial, networking and wireless markets.
The privately held company is based in Austin, Texas,
and has design, research and development, manufacturing or sales
operations in more than 30 countries. Freescale is one
of the world's largest semiconductor companies with 2006 sales
of $6.4 billion (USD). www.freescale.com.
About the Common Platform
IBM, Chartered
and Samsung Electronics have broken new ground in the
semiconductor industry with a unique collaboration focused on leading-edge,
jointly developed digital CMOS process technologies and advanced manufacturing.
The Common Platform model is further supported by a
comprehensive ecosystem of design enablement and implementation business partners
from the EDA, IP and design services industries. This
ecosystem allows foundry customers to potentially and competitively source
their chip designs to multiple 300mm foundries with unprecedented
flexibility and choice. The Common Platform model features 90nm,
65nm,45nm and 32nm technologies.
The Common Platform concept and
initial collaboration began in November, 2002, with an agreement
between Chartered and IBM to jointly develop advanced technology
and provide cross foundry manufacturing capacity to mutual customers.
Samsung joined the initiative in March 2004. Since then
the three companies have worked with some of the
world’s leading electronics companies to provide access to the
cutting-edge technology and seamless sourcing flexibility that Common Platform
can enable.
All news and press releases
Top
Loooooooooong Division
The Gut's Long Grip
Zapped By Radiation, Fungi Flourish
LOCKHEED MARTIN GAINS INTERNATIONAL ACCEPTANCE THAT THE TERM 'PAVEWAY' IS GENERIC
Boeing Business Jets, Ocean Sky Announce BBJ Order
Airbus joins United Nations Global Compact
Siemens HVDC transmission system based on new converter technology links offshore wind farms and oil platforms to the power grid on the mainland
AT&T Launches New Small Business Bundle Targeted to Startup Businesses
New Service Gives Pavlov Increased Internet Capabilities
Amazon.com Acquires Brilliance Audio
|
|
|
