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May 18, 2007
AMD Details Next-Generation Platform for Notebook PCs
Tokyo, Japan
-- May 18, 2007 --At a press conference in
Tokyo, Japan, AMD (NYSE: AMD) today officially disclosed more
details of its next-generation open platform for notebook computing.
Codenamed “Puma,” the platform is designed to deliver battery
life, graphics and video processing enhancements and improved overall
system performance for an enhanced visual experience. The “Puma”
platform is expected to build on the successful launches
of the AMD M690 mobile chipset and 65nm process-based
AMD Turion™ 64 X2 dual-core mobile technology in April
and May 2007, respectively.
The key technologies that comprise
“Puma” are AMD’s next-generation notebook processor, codenamed “Griffin”, matched
with the next-generation AMD “RS780” mobile chipset. This new
platform exemplifies AMD’s commitment to improve platform stability, time
to market, performance/energy-efficiency and overall consumer and commercial customers’
experience via its acquisition and integration of ATI. Notebooks
based on the “Puma” platform are expected to be
available in the mid-2008 timeframe.
“Through the combination of
our recent processor and chipset launches and the Better
by Design program, AMD is constantly establishing new heights
of competitiveness in serving the needs of our notebook
customers,” said Chris Cloran, vice president, AMD Notebook Division.
“With the unveiling of the “Puma” mobile platform we’re
sending a clear signal to the market that we
intend to drive continued innovation in notebook computing in
2008 and beyond.”
Next-Generation Microprocessor Architecture
Core to the
“Puma” platform is the introduction of AMD’s next-generation notebook
“Griffin” microprocessor. With “Griffin,” AMD will deliver a number
of new capabilities to enhance battery life and overall
mobile computing performance.
New notebook processing innovations in “Griffin”
include:
power optimized HyperTransport™ and memory controllers integrated in
the processor silicon that operate on a separate power
plane as the processor cores, thereby enabling the cores
to go into reduced power states;
dynamic performance scaling
offers enhanced battery life with reduced power consumption through
separate voltage planes enabling each core to operate at
independent frequency and voltage; and
power-optimized HyperTransport™ 3.0 with
a more than tripling of peak I/O bandwidth, plus
new power features including dynamic scaling of link widths.
“With this introduction, AMD is stepping up its mobility
story,” said Roger L. Kay, president, Endpoint Technologies Associates,
Inc. “With increased performance and power efficiency, Puma represents
the company's first explicitly mobile platform. It's safe to
assume that this offering is just the first of
what will be turn out to be a stream
of evolving products based on the company's new open-platform
mobile technology.”
“RS780” Platform Technology
“Griffin” will be complemented with
the forthcoming “RS780” notebook chipset to deliver a rich
visual experience and increased performance. Based on PCI Express®
Generation 2 and the HyperTransport™ 3.0 specifications,”RS780” is expected
to raise the bar on the notebook computing experience
by delivering significant new features such as:
Motherboard DirectX® 10
graphics processing
Energy efficient high-definition multimedia support with the
Unified Video Decoder
Integrated multi-monitor support with DVI, HDMI
and DisplayPort
Native southbridge support for NAND flash with
HyperFlash
PowerXpress for dynamic switching between integrated and discrete
graphics to extend battery life
The “Puma” platform is
based upon an open platform strategy. In addition to
the “Griffin” microprocessor and “RS780” chipset, the “Puma” platform
includes ATI Radeon™ graphics, NVIDIA chipset and graphics technologies,
and industry-leading wireless technologies.
With the launch of the
“Puma” platform, AMD is taking important steps in system-level
optimization through adding intelligence and increased coordination between the
CPU, GPU and chipset. The “Puma” platform sets the
stage for the next-wave of notebook processing innovation with
silicon-level CPU/GPU integration through “Fusion”.
“Puma” will be further
discussed during a presentation by AMD Fellow, Maurice Steinman
at the Spring Microprocessor Forum in San Jose, California
on May 22nd.
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